Reflow Oven

A re-flow oven is a machine used primarily for re-flow soldering of surface mount electronic components to printed circuit boards (PCBs). Commercial conveyor re-flow ovens contain multiple individually heated zones, which can be individually controlled for temperature. PCBs being processed travel through the oven and through each zone at a controlled rate. Technicians adjust the conveyor speed and zone temperatures to achieve a known time and temperature profile. The profile in use may vary depending on the requirements of the PCBs being processed at the time.

This new re-flow oven platform revolutionizes the industry with several new ground breaking designs and incorporates all of the customer requests for lower Delta T, reduced nitrogen consumption and extended PM into a new low height package that makes it easy to see across the production floor. We invite you to visit any of our three locations to run profiles and gather DATA for yourself to see the strong advantages of the re-flow oven for your production! Or if you prefer, send us your toughest pcb and we will run re-flow soldering profiles and generate the data for you. We are happy to work with you to custom configure your re-flow machines to suit your needs.
Highest Yield!
Lowest Delta T on the board
Lowest Nitrogen & Electrical Usage!
Maintenance Free!
VOID Free – with Vacuum option
Industry 4.0 Compatibility Re flow Oven
Integrated Cpk software at No Charge!

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Description

Reflow Oven w/New Low Height Top Shell

The new low height top shell provides much easier access for reflow oven operators. All skins have double insulation to save up to 10-15% in reflow soldering energy loss.

INDUSTRY 4.0 Compatible Reflow Oven

Internet of Manufacturing (IoM) — Smart factories, intelligent machines and networked processes through the use of cyber-physical systems.

Enhanced low height heater module provides the lowest Delta Ts with better air flow and uniformity! The Uniform Gas Management system eliminates “net flow” which results in nitrogen consumption reductions of up to 40%! New semi-circular heater is more robust and efficient with much longer lifetime.

Revolutionary Flux Management System

Our reflow oven has a revolutionary flux collection system that traps the flux in collection jars which can be easily removed and replaced while the reflow soldering oven is running – saving time consuming P.M. The new flux filtration box also has no risk of flux clogging for a longer-term P.M. interval. Additionally, our proprietary Flux-Free Grill system limits the flux residue on the cooling grills giving the Heller reflow oven system the highest production yields of any oven!

Reflow Oven CPK

We provide a dynamic 3 tiered system (Tier 1: Reflow Oven CPK, Tier 2 Process CPK, Tier 3 Product Traceability) enabling customers to quickly improve product quality and yield while reducing costs. And the additional benefits of automatic record keeping and recall provide customers with the peace of mind that all reflow soldering process parameters are under control and within spec.

Reflow Oven With Programmable Cooling

Reflow Oven Energy Management Software

SPECIFICATION:

Reflow Oven		Overall Length	# of Heating Zones	# of Cooling Zones	Max PCB Width
	1826**	465 cm (183″)	8	2 Top (std) Bottom Cool / External Cool optional	22″
	1809*	465 cm (183″)	9	2 Top (std) Bottom Cool / External Cool optional	22″
	1936**	590 cm (232″)	10	3 Top (std) Bottom Cool / External Cool optional	22″
	1913*	590 cm (232″)	13	3 Top (std) Bottom Cool / External Cool optional	22″
	2043**	678 cm (267″)	13	3 Top (std) Bottom Cool / External Cool optional	22″
	2049	744 cm (292″)	15	4 Top (std) Bottom Cool / External Cool optional	22″
	2156	869 cm (342″)	17	5 Top (std) Bottom Cool / External Cool optional	22″
The 1913, 1809 & 1707 Reflow Oven series have 10 inch wide heater modules for reduced liquidus time. *2043, 1936 & 1826 Reflow Oven models have 12 inch modules for profile compatibility with competitor systems. See all of our convection reflow ovens.