Description
- LTS-3051A: 64ℓ, 2 Zone
- LTS-3052A: 125ℓ,2 Zone
- LTS-3053A: 216ℓ, 2 Zone
Specification
Thermal shock testing is used commonly to evaluate and check the following: Evaluate PCB mounting reliability after a change in lead-free solder or another connection material. Evaluate reliability after a change in mounting format such as BGA or CSP. Evaluate connection resistance by connector temperature variation
A thermal shock tester is used to evaluate a material or product’s durability and reliability when exposed to extreme temperature changes. It’s used in many industries, including automotive, aerospace, medical, and defense.
How it works
A thermal shock tester rapidly changes the temperature of a sample between high and low temperatures.
The tester mimics the stresses a product may experience during transportation, storage, or use.
The tester identifies potential weaknesses, defects, or material failures.
What it’s used for
Evaluating reliability
Thermal shock testing can evaluate the reliability of a product after a change in mounting format or connection material.
Evaluating connection resistance
Thermal shock testing can evaluate connection resistance by varying the temperature of a connector.
Evaluating durability
Thermal shock testing can evaluate a product’s durability and potential breaking points.
Types of thermal shock tests
Liquid-to-liquid: This test is the most severe because of its rapid thermal rate of change.
Air-to-air: This test is used for parts that cannot be immersed in liquid.
Specification
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